Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
STMicroelectronicsProduct Type
MOSFET
Channel Type
Type N
Maximum Continuous Drain Current Id
64A
Maximum Drain Source Voltage Vds
650V
Tip pachet
ACEPACK SMIT
Montare
Surface
Numar pini
3
Maximum Drain Source Resistance Rds
41mΩ
Typical Gate Charge Qg @ Vgs
116nC
Temperatura minima de lucru
-55°C
Maximum Gate Source Voltage Vgs
25V
Temperatura maxima de lucru
150°C
Standards/Approvals
No
Automotive Standard
No
Tara de origine
Philippines
Detalii Produs
The STMicroelectronics combination of two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. The DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The high design flexibility of the package enables several configurations, including phase legs, boost, and single switch through different combinations of the internal power switches.
Inspiră. Proiectează. Colaborează
ÎNSCRIE-TE GRATIS
Fara taxe ascunse!
Informatii despre stoc temporar indisponibile
€ 6.206,00
€ 31,03 Buc. (Pe o rola de 200) (fara TVA)
€ 7.509,26
€ 37,546 Buc. (Pe o rola de 200) (cu TVA)
200
€ 6.206,00
€ 31,03 Buc. (Pe o rola de 200) (fara TVA)
€ 7.509,26
€ 37,546 Buc. (Pe o rola de 200) (cu TVA)
Informatii despre stoc temporar indisponibile
200
Inspiră. Proiectează. Colaborează
ÎNSCRIE-TE GRATIS
Fara taxe ascunse!
Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
STMicroelectronicsProduct Type
MOSFET
Channel Type
Type N
Maximum Continuous Drain Current Id
64A
Maximum Drain Source Voltage Vds
650V
Tip pachet
ACEPACK SMIT
Montare
Surface
Numar pini
3
Maximum Drain Source Resistance Rds
41mΩ
Typical Gate Charge Qg @ Vgs
116nC
Temperatura minima de lucru
-55°C
Maximum Gate Source Voltage Vgs
25V
Temperatura maxima de lucru
150°C
Standards/Approvals
No
Automotive Standard
No
Tara de origine
Philippines
Detalii Produs
The STMicroelectronics combination of two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. The DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The high design flexibility of the package enables several configurations, including phase legs, boost, and single switch through different combinations of the internal power switches.
Inspiră. Proiectează. Colaborează
ÎNSCRIE-TE GRATIS
Fara taxe ascunse!
