Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
STMicroelectronicsProduct Type
RF Transceiver
Tehnologie
IPD on Non-Conductive Glass Substrate
Sub Type
RF Transceiver
Tip pachet
Bumpless CSP
Numar pini
6
Montare
Surface
Operating Band 1 Frequency
2500MHz
Frecventa minima de auto-rezonanta
-40°C
Temperatura maxima de lucru
105°C
Lungime
1.63mm
Standards/Approvals
ECOPACK2
Series
MLPF-WB55
Number of Operating Bands
1
Automotive Standard
No
Tara de origine
China
Detalii Produs
The MLPF-WB55-01E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB55xx. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.
Informatii despre stoc temporar indisponibile
€ 6,50
€ 0,26 Buc. (Intr-un pachet de 25) (fara TVA)
€ 7,86
€ 0,315 Buc. (Intr-un pachet de 25) (cu TVA)
Standard
25
€ 6,50
€ 0,26 Buc. (Intr-un pachet de 25) (fara TVA)
€ 7,86
€ 0,315 Buc. (Intr-un pachet de 25) (cu TVA)
Informatii despre stoc temporar indisponibile
Standard
25
| Cantitate | Pret unitar | Per Pachet |
|---|---|---|
| 25 - 75 | € 0,26 | € 6,50 |
| 100 - 225 | € 0,24 | € 6,00 |
| 250 - 475 | € 0,22 | € 5,50 |
| 500 - 975 | € 0,21 | € 5,25 |
| 1000+ | € 0,19 | € 4,75 |
Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
STMicroelectronicsProduct Type
RF Transceiver
Tehnologie
IPD on Non-Conductive Glass Substrate
Sub Type
RF Transceiver
Tip pachet
Bumpless CSP
Numar pini
6
Montare
Surface
Operating Band 1 Frequency
2500MHz
Frecventa minima de auto-rezonanta
-40°C
Temperatura maxima de lucru
105°C
Lungime
1.63mm
Standards/Approvals
ECOPACK2
Series
MLPF-WB55
Number of Operating Bands
1
Automotive Standard
No
Tara de origine
China
Detalii Produs
The MLPF-WB55-01E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB55xx. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.