
Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
STMicroelectronicsProduct Type
Sensor
Number of Axis
6
Tehnologie
Gyroscope
Interfata
SPI
Frecventa maxima
20kHz
Frecventa minima
1.6Hz
Tensiune de alimentare minima
1.71V
Tensiune de alimentare maxima
3.6V
Tip pachet
VFLGA
Frecventa minima de auto-rezonanta
-40°C
Temperatura maxima de lucru
105°C
Lungime
2.5mm
Standards/Approvals
RoHS, GREEN, ECOPACK
Series
ISM330DHCX
Inaltime
0.83mm
Supply Current
1.5mA
Automotive Standard
No
Timp de raspuns
35ms
Tara de origine
Malta
Detalii Produs
The STMicroelectronics ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.;STs family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.;The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.;In the ISM330DHCX the sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness.;The ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enable its usage in a broad range of applications.;All the design aspects and the calibration of the ISM330DHCX have been optimized to reach superior accuracy, stability, extremely low noise and full data synchronization.;An unmatched set of embedded features (Machine Learning Core, programmable FSM, FIFO, sensor hub, event decoding and interrupts) are enablers for implementing smart and complex sensor nodes which deliver high performance at very low power.;The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package.
Informatii despre stoc temporar indisponibile
€ 38.850,00
€ 7,77 Buc. (Pe o rola de 5000) (fara TVA)
€ 47.008,50
€ 9,402 Buc. (Pe o rola de 5000) (cu TVA)
5000
€ 38.850,00
€ 7,77 Buc. (Pe o rola de 5000) (fara TVA)
€ 47.008,50
€ 9,402 Buc. (Pe o rola de 5000) (cu TVA)
Informatii despre stoc temporar indisponibile
5000
Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
STMicroelectronicsProduct Type
Sensor
Number of Axis
6
Tehnologie
Gyroscope
Interfata
SPI
Frecventa maxima
20kHz
Frecventa minima
1.6Hz
Tensiune de alimentare minima
1.71V
Tensiune de alimentare maxima
3.6V
Tip pachet
VFLGA
Frecventa minima de auto-rezonanta
-40°C
Temperatura maxima de lucru
105°C
Lungime
2.5mm
Standards/Approvals
RoHS, GREEN, ECOPACK
Series
ISM330DHCX
Inaltime
0.83mm
Supply Current
1.5mA
Automotive Standard
No
Timp de raspuns
35ms
Tara de origine
Malta
Detalii Produs
The STMicroelectronics ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.;STs family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.;The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.;In the ISM330DHCX the sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness.;The ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enable its usage in a broad range of applications.;All the design aspects and the calibration of the ISM330DHCX have been optimized to reach superior accuracy, stability, extremely low noise and full data synchronization.;An unmatched set of embedded features (Machine Learning Core, programmable FSM, FIFO, sensor hub, event decoding and interrupts) are enablers for implementing smart and complex sensor nodes which deliver high performance at very low power.;The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package.