TE Connectivity Micro Stack Series Vertical Board Connector Assembly, 80 Contact(s), 0.6 mm Pitch, 2 Row, Shrouded

The TE Connectivity PCB Mount Header is optimized for high-density board-to-board signal transmission in Compact electronic designs. With 80 positions and a fine 0.6 mm [.023 in] centerline spacing, it enables efficient routing while conserving valuable PCB real estate. Its partially shrouded vertical surface-mount configuration ensures precise mating and supports automated assembly.

• 80 Positions for dense signal interconnects
  
• 0.6 mm [.023 in] Centerline spacing for Compact layouts
  
• Partially Shrouded Housing improves alignment and mechanical stability
  
• Gold-Plated Contacts (Au) for superior conductivity and corrosion resistance
  
• Surface-Mount Design supports streamlined board stacking and reflow soldering