Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
STMicroelectronicsProduct Type
Microphone Condenser
Sensitivity
1dB
Directivity
Omni-Directional
Standard Operating Voltage
3.6V dc
Montare
Surface
Signal to Noise Ratio
65.5dB
Frecventa maxima
3.3MHz
Temperatura minima de lucru
-40°C
Temperatura maxima de lucru
85°C
Frecventa minima
1.5MHz
Inaltime
0.98mm
Standards/Approvals
No
Series
MP23DB01HP
Detalii Produs
The STMicroelectronics MP23DB01HP is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC Interface with stereo operation capability. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to producing audio sensors. The IC Interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.
Informatii despre stoc temporar indisponibile
€ 7,30
€ 1,46 Buc. (Intr-un pachet de 5) (fara TVA)
€ 8,83
€ 1,767 Buc. (Intr-un pachet de 5) (cu TVA)
Standard
5
€ 7,30
€ 1,46 Buc. (Intr-un pachet de 5) (fara TVA)
€ 8,83
€ 1,767 Buc. (Intr-un pachet de 5) (cu TVA)
Informatii despre stoc temporar indisponibile
Standard
5
Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
STMicroelectronicsProduct Type
Microphone Condenser
Sensitivity
1dB
Directivity
Omni-Directional
Standard Operating Voltage
3.6V dc
Montare
Surface
Signal to Noise Ratio
65.5dB
Frecventa maxima
3.3MHz
Temperatura minima de lucru
-40°C
Temperatura maxima de lucru
85°C
Frecventa minima
1.5MHz
Inaltime
0.98mm
Standards/Approvals
No
Series
MP23DB01HP
Detalii Produs
The STMicroelectronics MP23DB01HP is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC Interface with stereo operation capability. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to producing audio sensors. The IC Interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.