Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SemtechDirection Type
Bi-Directional
Diode Configuration
Isolated
Maximum Clamping Voltage
11V
Minimum Breakdown Voltage
6V
Timp montare
Surface Mount
Tip pachet
SOIC
Maximum Reverse Stand-off Voltage
5V
Numar pini
8
Peak Pulse Power Dissipation
300W
Maximum Peak Pulse Current
5.1A
ESD protection
Yes
Number of Elements per Chip
4
Temperatura minima de lucru
-55 °C
Dimensiuni
5 x 4 x 1.5mm
Temperatura maxima de lucru
+125 °C
Inaltime
1.5mm
Test Current
1mA
Lungime
5mm
Latime
4mm
Maximum Reverse Leakage Current
20µA
P.O.A.
Standard
1
P.O.A.
Informatii despre stoc temporar indisponibile
Standard
1
Informatii despre stoc temporar indisponibile
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SemtechDirection Type
Bi-Directional
Diode Configuration
Isolated
Maximum Clamping Voltage
11V
Minimum Breakdown Voltage
6V
Timp montare
Surface Mount
Tip pachet
SOIC
Maximum Reverse Stand-off Voltage
5V
Numar pini
8
Peak Pulse Power Dissipation
300W
Maximum Peak Pulse Current
5.1A
ESD protection
Yes
Number of Elements per Chip
4
Temperatura minima de lucru
-55 °C
Dimensiuni
5 x 4 x 1.5mm
Temperatura maxima de lucru
+125 °C
Inaltime
1.5mm
Test Current
1mA
Lungime
5mm
Latime
4mm
Maximum Reverse Leakage Current
20µA


