Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SamtecNumar contacte
320
Product Type
PCB Socket
Number of Rows
8
Sub Type
High Speed High Density Open-Pin-Field Array Socket
Pitch
1.27mm
Current
2.7A
Terminal
Solder
Housing Material
Liquid Crystal Polymer
Montare
Surface
Pozitionare
Straight
Stacking Height
18.5mm
Connector System
Board-to-Board
Tensiune
240V
Series
SEAF
Temperatura minima de lucru
-55°C
Row Pitch
2.5mm
Contact Gender
Female
Temperatura maxima de lucru
125°C
Material de contact
Copper
Placa contact
Gold
Standards/Approvals
No
Detalii Produs
This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.
Informatii despre stoc temporar indisponibile
€ 4.441,50
€ 19,74 Buc. (Pe o rola de 225) (fara TVA)
€ 5.374,22
€ 23,885 Buc. (Pe o rola de 225) (cu TVA)
225
€ 4.441,50
€ 19,74 Buc. (Pe o rola de 225) (fara TVA)
€ 5.374,22
€ 23,885 Buc. (Pe o rola de 225) (cu TVA)
Informatii despre stoc temporar indisponibile
225
Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SamtecNumar contacte
320
Product Type
PCB Socket
Number of Rows
8
Sub Type
High Speed High Density Open-Pin-Field Array Socket
Pitch
1.27mm
Current
2.7A
Terminal
Solder
Housing Material
Liquid Crystal Polymer
Montare
Surface
Pozitionare
Straight
Stacking Height
18.5mm
Connector System
Board-to-Board
Tensiune
240V
Series
SEAF
Temperatura minima de lucru
-55°C
Row Pitch
2.5mm
Contact Gender
Female
Temperatura maxima de lucru
125°C
Material de contact
Copper
Placa contact
Gold
Standards/Approvals
No
Detalii Produs
This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.