Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SamtecProduct Type
PCB Header
Series
ERM8
Pitch
800μm
Current
1.4A
Housing Material
Liquid Crystal Polymer
Numar contacte
40
Number of Rows
2
Pozitionare
Vertical
Shrouded/Unshrouded
Shrouded
Connector System
Board-to-Board
Montare
Surface
Placa contact
Gold
Material de contact
Phosphor Bronze
Temperatura minima de lucru
-55°C
Row Pitch
800μm
Terminal
Solder
Contact Gender
Male
Temperatura maxima de lucru
125°C
Standards/Approvals
No
Tensiune
318V
Detalii Produs
The Samtec ERM8 0.80 mm is a board-mounted header designed for use in high-speed system. The ERM8 uses the Edge rate contact system which is designed for application requiring high-mating cycle and 56Gbps PAM4 performance. It have 0.25 μm gold plating con
Informatii despre stoc temporar indisponibile
€ 1.452,50
€ 4,15 Buc. (Pe o rola de 350) (fara TVA)
€ 1.757,52
€ 5,022 Buc. (Pe o rola de 350) (cu TVA)
350
€ 1.452,50
€ 4,15 Buc. (Pe o rola de 350) (fara TVA)
€ 1.757,52
€ 5,022 Buc. (Pe o rola de 350) (cu TVA)
Informatii despre stoc temporar indisponibile
350
| Cantitate | Pret unitar | Per Rola |
|---|---|---|
| 350 - 350 | € 4,15 | € 1.452,50 |
| 700 - 1050 | € 3,79 | € 1.326,50 |
| 1400+ | € 3,64 | € 1.274,00 |
Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SamtecProduct Type
PCB Header
Series
ERM8
Pitch
800μm
Current
1.4A
Housing Material
Liquid Crystal Polymer
Numar contacte
40
Number of Rows
2
Pozitionare
Vertical
Shrouded/Unshrouded
Shrouded
Connector System
Board-to-Board
Montare
Surface
Placa contact
Gold
Material de contact
Phosphor Bronze
Temperatura minima de lucru
-55°C
Row Pitch
800μm
Terminal
Solder
Contact Gender
Male
Temperatura maxima de lucru
125°C
Standards/Approvals
No
Tensiune
318V
Detalii Produs
The Samtec ERM8 0.80 mm is a board-mounted header designed for use in high-speed system. The ERM8 uses the Edge rate contact system which is designed for application requiring high-mating cycle and 56Gbps PAM4 performance. It have 0.25 μm gold plating con