Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexProduct Type
PCB Header
Series
87759
Pitch
2mm
Current
2A
Housing Material
High Temperature Thermoplastic
Numar contacte
36
Number of Rows
2
Pozitionare
Vertical
Shrouded/Unshrouded
Unshrouded
Connector System
Board-to-Board
Montare
Surface
Material de contact
Phosphor Bronze
Placa contact
Gold
Temperatura minima de lucru
-55°C
Terminal
Surface Mount
Temperatura maxima de lucru
125°C
Standards/Approvals
UL E29179, CSA LR19980
Tensiune
125V
Tara de origine
Indonesia
Detalii Produs
The Molex Milli Grid Header is designed for efficient, reliable connections in PCB applications, featuring a surface mount and vertical orientation. With a robust construction comprising of 36 circuits and gold selective plating, this component ensures optimal electrical performance while accommodating high-density interconnections. It is engineered for a temperature range of -55° to +125°C, allowing for versatile usage across various environments. The milli-grid header is Ideal for board-to-board signal applications, providing a seamless and secure Interface with various mating parts to enhance system integration and durability.
Informatii despre stoc temporar indisponibile
P.O.A.
1
P.O.A.
Informatii despre stoc temporar indisponibile
1
Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexProduct Type
PCB Header
Series
87759
Pitch
2mm
Current
2A
Housing Material
High Temperature Thermoplastic
Numar contacte
36
Number of Rows
2
Pozitionare
Vertical
Shrouded/Unshrouded
Unshrouded
Connector System
Board-to-Board
Montare
Surface
Material de contact
Phosphor Bronze
Placa contact
Gold
Temperatura minima de lucru
-55°C
Terminal
Surface Mount
Temperatura maxima de lucru
125°C
Standards/Approvals
UL E29179, CSA LR19980
Tensiune
125V
Tara de origine
Indonesia
Detalii Produs
The Molex Milli Grid Header is designed for efficient, reliable connections in PCB applications, featuring a surface mount and vertical orientation. With a robust construction comprising of 36 circuits and gold selective plating, this component ensures optimal electrical performance while accommodating high-density interconnections. It is engineered for a temperature range of -55° to +125°C, allowing for versatile usage across various environments. The milli-grid header is Ideal for board-to-board signal applications, providing a seamless and secure Interface with various mating parts to enhance system integration and durability.