Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexProduct Type
Header
Series
87759
Pitch
2mm
Current
2A
Numar contacte
12
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Pozitionare
Vertical
Shrouded/Unshrouded
Unshrouded
Montare
Surface Mount
Connector System
Board to Board Connectivity
Material de contact
Phosphor Bronze
Placa contact
Gold Plated
Temperatura minima de lucru
-55°C
Terminal
Surface Mount
Temperatura maxima de lucru
125°C
Standards/Approvals
UL E29179
Tensiune
125V
Tara de origine
Indonesia
Detalii Produs
The Molex Milli Grid Header is a cutting-edge surface mount connector designed for seamless board-to-board and signal applications. With a robust configuration of 12 circuits and featuring Advanced selective gold plating, this component ensures exceptional connectivity and reliability in electronic setups. Its vertical orientation and high-temperature thermoplastic construction make it Ideal for demanding environments, offering a Durable solution that meets stringent international compliance standards.
Informatii despre stoc temporar indisponibile
P.O.A.
1
P.O.A.
Informatii despre stoc temporar indisponibile
1
Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexProduct Type
Header
Series
87759
Pitch
2mm
Current
2A
Numar contacte
12
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Pozitionare
Vertical
Shrouded/Unshrouded
Unshrouded
Montare
Surface Mount
Connector System
Board to Board Connectivity
Material de contact
Phosphor Bronze
Placa contact
Gold Plated
Temperatura minima de lucru
-55°C
Terminal
Surface Mount
Temperatura maxima de lucru
125°C
Standards/Approvals
UL E29179
Tensiune
125V
Tara de origine
Indonesia
Detalii Produs
The Molex Milli Grid Header is a cutting-edge surface mount connector designed for seamless board-to-board and signal applications. With a robust configuration of 12 circuits and featuring Advanced selective gold plating, this component ensures exceptional connectivity and reliability in electronic setups. Its vertical orientation and high-temperature thermoplastic construction make it Ideal for demanding environments, offering a Durable solution that meets stringent international compliance standards.