Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexNumar contacte
64
Product Type
PCB Socket
Number of Rows
2
Sub Type
Socket
Pitch
1mm
Current
1A
Terminal
Surface Mount
Housing Material
High Temperature Thermoplastic
Montare
Surface Mount
Pozitionare
Vertical
Stacking Height
13mm
Connector System
Board-to-Board
Tensiune
100V
Series
71439
Temperatura minima de lucru
-55°C
Temperatura maxima de lucru
85°C
Material de contact
Phosphor Bronze
Placa contact
Gold
Standards/Approvals
UL
Tara de origine
China
Detalii Produs
The Molex 1.00mm Mezzanine Receptacle is expertly designed for seamless board-to-board connectivity in high-performance applications. This component delivers exceptional reliability with its dual-row configuration, offering 64 circuits to facilitate robust signal transmission. The surface mount design enhances installation efficiency, while the vertical stacking capability significantly optimises space utilisation on PCBs. With a gold-plated mating surface and Advanced high-temperature thermoplastic materials, this receptacle ensures durability and compliance with various industry standards, making it an Ideal choice for modern electronic systems.
Informatii despre stoc temporar indisponibile
P.O.A.
1
P.O.A.
Informatii despre stoc temporar indisponibile
1
Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexNumar contacte
64
Product Type
PCB Socket
Number of Rows
2
Sub Type
Socket
Pitch
1mm
Current
1A
Terminal
Surface Mount
Housing Material
High Temperature Thermoplastic
Montare
Surface Mount
Pozitionare
Vertical
Stacking Height
13mm
Connector System
Board-to-Board
Tensiune
100V
Series
71439
Temperatura minima de lucru
-55°C
Temperatura maxima de lucru
85°C
Material de contact
Phosphor Bronze
Placa contact
Gold
Standards/Approvals
UL
Tara de origine
China
Detalii Produs
The Molex 1.00mm Mezzanine Receptacle is expertly designed for seamless board-to-board connectivity in high-performance applications. This component delivers exceptional reliability with its dual-row configuration, offering 64 circuits to facilitate robust signal transmission. The surface mount design enhances installation efficiency, while the vertical stacking capability significantly optimises space utilisation on PCBs. With a gold-plated mating surface and Advanced high-temperature thermoplastic materials, this receptacle ensures durability and compliance with various industry standards, making it an Ideal choice for modern electronic systems.