Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 2 Contact(s), 3 mm Pitch, 1 Row(s), Shrouded

Nr. stoc RS: 670-2119PProducator: MolexCod de producator: 43650-0209
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Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)

Specificatii

Marca

Molex

Serie

Micro-Fit 3.0

Product Type

PCB Header

Pitch

3mm

Current

5A

Numar contacte

2

Housing Material

High Temperature Thermoplastic

Number of Rows

1

Pozitionare

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Montare

Surface

Material de contact

Brass

Placa contact

Tin

Temperatura minima de lucru

-40°C

Row Pitch

3mm

Terminal

Solder

Contact Gender

Male

Temperatura maxima de lucru

105°C

Standards/Approvals

No

Tensiune

250 V

Tara de origine

Mexico

Detalii produs

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Press Fit Metal Retention Clip, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board PCB thruogh hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, solderable metal press-fit retention clips are incorporated into the connector design. The through hole versions with part numbers endng in xx18 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

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Informatii despre stoc temporar indisponibile

€ 7,40

€ 1,48 Buc. (Livrat pe rola) (fara TVA)

€ 8,95

€ 1,791 Buc. (Livrat pe rola) (cu TVA)

Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 2 Contact(s), 3 mm Pitch, 1 Row(s), Shrouded
Selectati tipul de ambalaj

€ 7,40

€ 1,48 Buc. (Livrat pe rola) (fara TVA)

€ 8,95

€ 1,791 Buc. (Livrat pe rola) (cu TVA)

Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 2 Contact(s), 3 mm Pitch, 1 Row(s), Shrouded

Informatii despre stoc temporar indisponibile

Selectati tipul de ambalaj

Inspiră. Proiectează. Colaborează

ÎNSCRIE-TE GRATIS

Fara taxe ascunse!

design-spark
design-spark
  • Descărcați și utilizați software-ul nostru DesignSpark pentru modelele dumneavoastră PCB și mecanice 3D
  • Vizualizați și contribuiți cu conținutul site-ului web și forumuri
  • Descărcați modele 3D, scheme și amprente de la peste un milion de produse
Click aici pentru a afla mai multe

Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)

Specificatii

Marca

Molex

Serie

Micro-Fit 3.0

Product Type

PCB Header

Pitch

3mm

Current

5A

Numar contacte

2

Housing Material

High Temperature Thermoplastic

Number of Rows

1

Pozitionare

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Montare

Surface

Material de contact

Brass

Placa contact

Tin

Temperatura minima de lucru

-40°C

Row Pitch

3mm

Terminal

Solder

Contact Gender

Male

Temperatura maxima de lucru

105°C

Standards/Approvals

No

Tensiune

250 V

Tara de origine

Mexico

Detalii produs

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Press Fit Metal Retention Clip, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board PCB thruogh hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, solderable metal press-fit retention clips are incorporated into the connector design. The through hole versions with part numbers endng in xx18 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

Inspiră. Proiectează. Colaborează

ÎNSCRIE-TE GRATIS

Fara taxe ascunse!

design-spark
design-spark
  • Descărcați și utilizați software-ul nostru DesignSpark pentru modelele dumneavoastră PCB și mecanice 3D
  • Vizualizați și contribuiți cu conținutul site-ului web și forumuri
  • Descărcați modele 3D, scheme și amprente de la peste un milion de produse
Click aici pentru a afla mai multe