Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexProduct Type
PCB Header
Series
43045
Pitch
3mm
Current
8.5A
Numar contacte
18
Housing Material
Thermoplastic
Number of Rows
2
Pozitionare
Vertical
Shrouded/Unshrouded
Shrouded
Montare
Through Hole
Connector System
Wire-to-Board
Material de contact
Brass
Placa contact
Gold
Frecventa minima de auto-rezonanta
-40°C
Terminal
Through Hole
Temperatura maxima de lucru
105°C
Tara de origine
China
Detalii Produs
The Molex Micro-Fit 3.0 Vertical Header is expertly engineered for power and wire-to-board applications, delivering high reliability in demanding environments. This component features a Compact design with a 3.00mm pitch and dual-row configuration, accommodating up to 18 circuits. Its robust construction includes high-temperature thermoplastic materials and a gold-plated mating interface, ensuring durability and excellent electrical performance. With compliance to international safety standards, this header offers peace of mind for engineers seeking a dependable solution for their PCB header and receptacle needs, particularly in applications requiring a high-temperature performance. Additional features like full shrouding and a secure PCB retention mechanism make it an Ideal choice for Advanced electronics.
Informatii despre stoc temporar indisponibile
€ 11,06
€ 11,06 1 Pack of 2 (fara TVA)
€ 13,38
€ 13,38 1 Pack of 2 (cu TVA)
1
€ 11,06
€ 11,06 1 Pack of 2 (fara TVA)
€ 13,38
€ 13,38 1 Pack of 2 (cu TVA)
Informatii despre stoc temporar indisponibile
1
| Cantitate | Pret unitar |
|---|---|
| 1 - 9 | € 11,06 |
| 10 - 24 | € 9,98 |
| 25+ | € 8,92 |
Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexProduct Type
PCB Header
Series
43045
Pitch
3mm
Current
8.5A
Numar contacte
18
Housing Material
Thermoplastic
Number of Rows
2
Pozitionare
Vertical
Shrouded/Unshrouded
Shrouded
Montare
Through Hole
Connector System
Wire-to-Board
Material de contact
Brass
Placa contact
Gold
Frecventa minima de auto-rezonanta
-40°C
Terminal
Through Hole
Temperatura maxima de lucru
105°C
Tara de origine
China
Detalii Produs
The Molex Micro-Fit 3.0 Vertical Header is expertly engineered for power and wire-to-board applications, delivering high reliability in demanding environments. This component features a Compact design with a 3.00mm pitch and dual-row configuration, accommodating up to 18 circuits. Its robust construction includes high-temperature thermoplastic materials and a gold-plated mating interface, ensuring durability and excellent electrical performance. With compliance to international safety standards, this header offers peace of mind for engineers seeking a dependable solution for their PCB header and receptacle needs, particularly in applications requiring a high-temperature performance. Additional features like full shrouding and a secure PCB retention mechanism make it an Ideal choice for Advanced electronics.