Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexProduct Type
Header
Series
43045
Pitch
3mm
Current
8.5A
Numar contacte
18
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Pozitionare
Vertical
Shrouded/Unshrouded
Shrouded
Montare
Surface
Connector System
Wire-to-Board
Material de contact
Brass
Placa contact
Gold
Frecventa minima de auto-rezonanta
-40°C
Terminal
Solder
Temperatura maxima de lucru
125°C
Standards/Approvals
CSA LR19980, UL E29179
Tara de origine
China
Detalii Produs
The Molex Micro-Fit 3.0 Vertical Header is engineered for reliable interconnections in Compact electronic assemblies. This robust header features a 3.00mm pitch, accommodating dual rows with 18 circuits, and is equipped with solder tabs for secure connections. Designed for power and wire-to-board applications, it provides excellent durability and thermal efficiency, ensuring optimal performance in high-temperature environments. The vertical orientation and Compact size facilitate easy integration into various PCB designs, making it an Ideal choice for engineers seeking efficiency and reliability in their electronic applications.
Informatii despre stoc temporar indisponibile
€ 1.942,27
€ 1.942,27 1 Reel of 200 (fara TVA)
€ 2.350,15
€ 2.350,15 1 Reel of 200 (cu TVA)
1
€ 1.942,27
€ 1.942,27 1 Reel of 200 (fara TVA)
€ 2.350,15
€ 2.350,15 1 Reel of 200 (cu TVA)
Informatii despre stoc temporar indisponibile
1
Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexProduct Type
Header
Series
43045
Pitch
3mm
Current
8.5A
Numar contacte
18
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Pozitionare
Vertical
Shrouded/Unshrouded
Shrouded
Montare
Surface
Connector System
Wire-to-Board
Material de contact
Brass
Placa contact
Gold
Frecventa minima de auto-rezonanta
-40°C
Terminal
Solder
Temperatura maxima de lucru
125°C
Standards/Approvals
CSA LR19980, UL E29179
Tara de origine
China
Detalii Produs
The Molex Micro-Fit 3.0 Vertical Header is engineered for reliable interconnections in Compact electronic assemblies. This robust header features a 3.00mm pitch, accommodating dual rows with 18 circuits, and is equipped with solder tabs for secure connections. Designed for power and wire-to-board applications, it provides excellent durability and thermal efficiency, ensuring optimal performance in high-temperature environments. The vertical orientation and Compact size facilitate easy integration into various PCB designs, making it an Ideal choice for engineers seeking efficiency and reliability in their electronic applications.