Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexProduct Type
Header
Series
43045
Pitch
3mm
Current
8.5A
Numar contacte
16
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Pozitionare
Vertical
Shrouded/Unshrouded
Shrouded
Montare
Through Hole
Connector System
Wire-to-Board
Material de contact
Brass
Placa contact
Gold
Temperatura minima de lucru
-40°C
Terminal
Through Hole
Temperatura maxima de lucru
125°C
Standards/Approvals
UL E29179, CSA LR19980
Tara de origine
China
Detalii Produs
The Molex Micro-Fit 3.0 Vertical Header is designed for reliable power and signal connectivity in Compact electronic applications. With a 3.00mm pitch and accommodating up to 16 circuits, this dual-row header features a PCB press-fit metal retention clip and gold plating, ensuring robust performance and durability. Engineered for high-temperature environments, it supports a temperature range from -40° to +125°C and meets various industry compliance standards, making it Ideal for demanding applications. The Micro-Fit 3.0 series is perfect for wire-to-board connections, providing a secure and efficient Interface for your electronic assemblies.
Informatii despre stoc temporar indisponibile
€ 252,68
€ 252,68 1 Tray of 50 (fara TVA)
€ 305,74
€ 305,74 1 Tray of 50 (cu TVA)
1
€ 252,68
€ 252,68 1 Tray of 50 (fara TVA)
€ 305,74
€ 305,74 1 Tray of 50 (cu TVA)
Informatii despre stoc temporar indisponibile
1
Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexProduct Type
Header
Series
43045
Pitch
3mm
Current
8.5A
Numar contacte
16
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Pozitionare
Vertical
Shrouded/Unshrouded
Shrouded
Montare
Through Hole
Connector System
Wire-to-Board
Material de contact
Brass
Placa contact
Gold
Temperatura minima de lucru
-40°C
Terminal
Through Hole
Temperatura maxima de lucru
125°C
Standards/Approvals
UL E29179, CSA LR19980
Tara de origine
China
Detalii Produs
The Molex Micro-Fit 3.0 Vertical Header is designed for reliable power and signal connectivity in Compact electronic applications. With a 3.00mm pitch and accommodating up to 16 circuits, this dual-row header features a PCB press-fit metal retention clip and gold plating, ensuring robust performance and durability. Engineered for high-temperature environments, it supports a temperature range from -40° to +125°C and meets various industry compliance standards, making it Ideal for demanding applications. The Micro-Fit 3.0 series is perfect for wire-to-board connections, providing a secure and efficient Interface for your electronic assemblies.