Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexSeries
iGrid 2.0
Product Type
PCB Header
Pitch
2mm
Current
2A
Housing Material
Polyamide
Numar contacte
14
Number of Rows
2
Pozitionare
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
iGrid Wire to Board Dual Row System
Montare
Through Hole
Material de contact
Brass
Placa contact
Gold
Row Pitch
2mm
Terminal
Solder
Temperatura minima de lucru
-40°C
Tail Pin Length
3.2mm
Temperatura maxima de lucru
105°C
Standards/Approvals
UL E29179
Tensiune
250V
Tara de origine
Japan
Detalii Produs
The Molex iGrid PCB header made up of the brass metal and having the gold plating. The header through hole termination method. The header has maximum current per contact 2A and maximum voltage 250V AC.
Informatii despre stoc temporar indisponibile
€ 150,86
€ 150,86 1 Tray of 100 (fara TVA)
€ 182,54
€ 182,54 1 Tray of 100 (cu TVA)
1
€ 150,86
€ 150,86 1 Tray of 100 (fara TVA)
€ 182,54
€ 182,54 1 Tray of 100 (cu TVA)
Informatii despre stoc temporar indisponibile
1
Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexSeries
iGrid 2.0
Product Type
PCB Header
Pitch
2mm
Current
2A
Housing Material
Polyamide
Numar contacte
14
Number of Rows
2
Pozitionare
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
iGrid Wire to Board Dual Row System
Montare
Through Hole
Material de contact
Brass
Placa contact
Gold
Row Pitch
2mm
Terminal
Solder
Temperatura minima de lucru
-40°C
Tail Pin Length
3.2mm
Temperatura maxima de lucru
105°C
Standards/Approvals
UL E29179
Tensiune
250V
Tara de origine
Japan
Detalii Produs
The Molex iGrid PCB header made up of the brass metal and having the gold plating. The header through hole termination method. The header has maximum current per contact 2A and maximum voltage 250V AC.