Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
TE ConnectivityProduct Type
Sensor Development Tool
Tehnologie senzor
Temperature
Featured Device
TSYS01
Utilizare cu
Xplained Pro Systems
Clasificare
Development Board
Kit Name
Xplained Pro
Standards/Approvals
RoHS Compliant
Tara de origine
China
Detalii Produs
The TE Connectivity Xplained Pro Board is a development and evaluation module designed for temperature sensing applications. It integrates the TSYS01 digital temperature sensor with the Xplained Pro platform, offering a convenient way to evaluate sensor performance and Interface with microcontroller development boards. This module is Ideal for Rapid prototyping, system integration, and educational use in embedded systems and IoT projects.
Informatii despre stoc temporar indisponibile
€ 399,84
€ 49,98 Buc. (Intr-un pachet de 8) (fara TVA)
€ 483,81
€ 60,476 Buc. (Intr-un pachet de 8) (cu TVA)
8
€ 399,84
€ 49,98 Buc. (Intr-un pachet de 8) (fara TVA)
€ 483,81
€ 60,476 Buc. (Intr-un pachet de 8) (cu TVA)
Informatii despre stoc temporar indisponibile
8
| Cantitate | Pret unitar | Per Pachet |
|---|---|---|
| 8 - 32 | € 49,98 | € 399,84 |
| 40+ | € 48,98 | € 391,84 |
Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
TE ConnectivityProduct Type
Sensor Development Tool
Tehnologie senzor
Temperature
Featured Device
TSYS01
Utilizare cu
Xplained Pro Systems
Clasificare
Development Board
Kit Name
Xplained Pro
Standards/Approvals
RoHS Compliant
Tara de origine
China
Detalii Produs
The TE Connectivity Xplained Pro Board is a development and evaluation module designed for temperature sensing applications. It integrates the TSYS01 digital temperature sensor with the Xplained Pro platform, offering a convenient way to evaluate sensor performance and Interface with microcontroller development boards. This module is Ideal for Rapid prototyping, system integration, and educational use in embedded systems and IoT projects.
