Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
STMicroelectronicsProduct Type
Signal Filter
Series
MLPF
Packaging
Tape and Reel
Montare
Surface
Operating Frequency
479MHz
Terminal
Surface Mount
Package/Case
CSPG
Temperatura minima de lucru
-40°C
Temperatura maxima de lucru
105°C
Lungime
1.92mm
Inaltime
0.68mm
Adancime
1.52mm
Tara de origine
France
Detalii Produs
The STMicroelectronics RF matched filter high power two layer PCB integrates an impedance matching network along with a harmonics filter to enhance overall system efficiency. The impedance matching network has been carefully designed to maximize RF performance, ensuring reliable operation across demanding applications. This solution makes use of STMicroelectronics IPD technology on a non conductive glass substrate, which further optimizes RF characteristics and delivers improved robustness and efficiency.
Informatii despre stoc temporar indisponibile
€ 1.150,00
€ 0,23 Buc. (Pe o rola de 5000) (fara TVA)
€ 1.391,50
€ 0,278 Buc. (Pe o rola de 5000) (cu TVA)
5000
€ 1.150,00
€ 0,23 Buc. (Pe o rola de 5000) (fara TVA)
€ 1.391,50
€ 0,278 Buc. (Pe o rola de 5000) (cu TVA)
Informatii despre stoc temporar indisponibile
5000
Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
STMicroelectronicsProduct Type
Signal Filter
Series
MLPF
Packaging
Tape and Reel
Montare
Surface
Operating Frequency
479MHz
Terminal
Surface Mount
Package/Case
CSPG
Temperatura minima de lucru
-40°C
Temperatura maxima de lucru
105°C
Lungime
1.92mm
Inaltime
0.68mm
Adancime
1.52mm
Tara de origine
France
Detalii Produs
The STMicroelectronics RF matched filter high power two layer PCB integrates an impedance matching network along with a harmonics filter to enhance overall system efficiency. The impedance matching network has been carefully designed to maximize RF performance, ensuring reliable operation across demanding applications. This solution makes use of STMicroelectronics IPD technology on a non conductive glass substrate, which further optimizes RF characteristics and delivers improved robustness and efficiency.