Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexProduct Type
PCB Header
Series
Micro-Fit 3.0
Pitch
3mm
Current
5A
Numar contacte
6
Housing Material
High Temperature Thermoplastic
Number of Rows
1
Pozitionare
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Montare
Surface
Material de contact
Brass
Placa contact
Gold
Frecventa minima de auto-rezonanta
-40°C
Row Pitch
3mm
Terminal
Solder
Contact Gender
Male
Temperatura maxima de lucru
125°C
Standards/Approvals
No
Tensiune
250V
Tara de origine
Mexico
Detalii Produs
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals
Informatii despre stoc temporar indisponibile
€ 358,00
€ 3,58 Buc. (Livrat pe rola) (fara TVA)
€ 433,18
€ 4,332 Buc. (Livrat pe rola) (cu TVA)
Impachetare pentru productie (Rola)
100
€ 358,00
€ 3,58 Buc. (Livrat pe rola) (fara TVA)
€ 433,18
€ 4,332 Buc. (Livrat pe rola) (cu TVA)
Informatii despre stoc temporar indisponibile
Impachetare pentru productie (Rola)
100
| Cantitate | Pret unitar | Per Rola |
|---|---|---|
| 100 - 370 | € 3,58 | € 17,90 |
| 375 - 1495 | € 3,45 | € 17,25 |
| 1500 - 2995 | € 3,32 | € 16,60 |
| 3000+ | € 3,20 | € 16,00 |
Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
MolexProduct Type
PCB Header
Series
Micro-Fit 3.0
Pitch
3mm
Current
5A
Numar contacte
6
Housing Material
High Temperature Thermoplastic
Number of Rows
1
Pozitionare
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Montare
Surface
Material de contact
Brass
Placa contact
Gold
Frecventa minima de auto-rezonanta
-40°C
Row Pitch
3mm
Terminal
Solder
Contact Gender
Male
Temperatura maxima de lucru
125°C
Standards/Approvals
No
Tensiune
250V
Tara de origine
Mexico
Detalii Produs
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals