Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
InfineonProduct Type
Sensor Development Tool
Tehnologie senzor
Angle Sensor
Featured Device
TLE5309 E1211 Angle Sensor
Utilizare cu
XMCTM4700 platform
Clasificare
Evaluation Kit
Kit Name
TLE5309 EVAL KIT
Standards/Approvals
RoHS
Detalii Produs
The Infineon's XENSIVTM offers a set of different Evalkits and boards to enable fast and easy evaluation of TLE5x09 Dual Die angle sensors. This kit is based on XMC™ 4700 platform. The kit is equipped with the TLE5x09A16(D) dual die angle sensor and a FTDI chip that implements a high baud rate communication.
Informatii despre stoc temporar indisponibile
€ 58,00
€ 58,00 Buc. (fara TVA)
€ 70,18
€ 70,18 Buc. (cu TVA)
1
€ 58,00
€ 58,00 Buc. (fara TVA)
€ 70,18
€ 70,18 Buc. (cu TVA)
Informatii despre stoc temporar indisponibile
1
Documente Tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
InfineonProduct Type
Sensor Development Tool
Tehnologie senzor
Angle Sensor
Featured Device
TLE5309 E1211 Angle Sensor
Utilizare cu
XMCTM4700 platform
Clasificare
Evaluation Kit
Kit Name
TLE5309 EVAL KIT
Standards/Approvals
RoHS
Detalii Produs
The Infineon's XENSIVTM offers a set of different Evalkits and boards to enable fast and easy evaluation of TLE5x09 Dual Die angle sensors. This kit is based on XMC™ 4700 platform. The kit is equipped with the TLE5x09A16(D) dual die angle sensor and a FTDI chip that implements a high baud rate communication.
