Documente tehnice
Specificatii
Marca
WolfspeedChannel Type
N
Maximum Continuous Drain Current
35 A
Maximum Drain Source Voltage
900 V
Tip pachet
D2PAK (TO-263)
Timp montare
Surface Mount
Numar pini
7
Maximum Drain Source Resistance
78 mΩ
Channel Mode
Enhancement
Maximum Gate Threshold Voltage
2.1V
Minimum Gate Threshold Voltage
1.8V
Maximum Power Dissipation
113 W
Transistor Configuration
Single
Maximum Gate Source Voltage
+25 V
Number of Elements per Chip
1
Temperatura maxima de lucru
+150 °C
Lungime
10.23mm
Typical Gate Charge @ Vgs
30 nC @ 15 V
Latime
10.99mm
Transistor Material
SiC
Frecventa minima de auto-rezonanta
-55 °C
Forward Diode Voltage
4.4V
Inaltime
4.57mm
Tara de origine
China
Detalii produs
Wolfspeed Silicon Carbide Power MOSFETs
Wolfspeed Z-Fet™, C2M™ & C3M™ Silicon Carbide Power MOSFETs. A range of second generation SiC MOSFETs from Cree's power division Wolfspeed which deliver industry-leading power density and switching efficiency. These low-capacitance devices allow higher switching frequencies and have reduced cooling requirements improving overall system operating efficiency.
MOSFET Transistors, Wolfspeed
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Documente tehnice
Specificatii
Marca
WolfspeedChannel Type
N
Maximum Continuous Drain Current
35 A
Maximum Drain Source Voltage
900 V
Tip pachet
D2PAK (TO-263)
Timp montare
Surface Mount
Numar pini
7
Maximum Drain Source Resistance
78 mΩ
Channel Mode
Enhancement
Maximum Gate Threshold Voltage
2.1V
Minimum Gate Threshold Voltage
1.8V
Maximum Power Dissipation
113 W
Transistor Configuration
Single
Maximum Gate Source Voltage
+25 V
Number of Elements per Chip
1
Temperatura maxima de lucru
+150 °C
Lungime
10.23mm
Typical Gate Charge @ Vgs
30 nC @ 15 V
Latime
10.99mm
Transistor Material
SiC
Frecventa minima de auto-rezonanta
-55 °C
Forward Diode Voltage
4.4V
Inaltime
4.57mm
Tara de origine
China
Detalii produs
Wolfspeed Silicon Carbide Power MOSFETs
Wolfspeed Z-Fet™, C2M™ & C3M™ Silicon Carbide Power MOSFETs. A range of second generation SiC MOSFETs from Cree's power division Wolfspeed which deliver industry-leading power density and switching efficiency. These low-capacitance devices allow higher switching frequencies and have reduced cooling requirements improving overall system operating efficiency.