Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 1.3W/m·K, Thin Film Polyimide, 19.05 x 12.7mm
Documente tehnice
Specificatii
Marca
BergquistDimensiuni
19.05 x 12.7mm
Grosime
0.152mm
Lungime
19.05mm
Latime
12.7mm
Thermal Conductivity
1.3W/m·K
Material
Thin Film Polyimide
Self-Adhesive
Yes
Frecventa minima de auto-rezonanta
-60°C
Temperatura maxima de lucru
+180°C
Hardness
Shore A 90
Material
Sil-Pad K10
Temperatura de lucru
-60 → +180 °C
Tara de origine
United States
Detalii produs
Sil-Pad K10 insulators
Informatii indisponibile despre stoc
Incercati din nou mai tarziu
€ 2,18
Buc. (Intr-un pachet de 10) (fara TVA)
€ 2,594
Buc. (Intr-un pachet de 10) (cu TVA)
10
€ 2,18
Buc. (Intr-un pachet de 10) (fara TVA)
€ 2,594
Buc. (Intr-un pachet de 10) (cu TVA)
10
Cumpara in pachete mari
| Cantitate | Pret unitar | Per Pachet |
|---|---|---|
| 10 - 90 | € 2,18 | € 21,80 |
| 100 - 490 | € 1,89 | € 18,90 |
| 500+ | € 1,67 | € 16,70 |
Documente tehnice
Specificatii
Marca
BergquistDimensiuni
19.05 x 12.7mm
Grosime
0.152mm
Lungime
19.05mm
Latime
12.7mm
Thermal Conductivity
1.3W/m·K
Material
Thin Film Polyimide
Self-Adhesive
Yes
Frecventa minima de auto-rezonanta
-60°C
Temperatura maxima de lucru
+180°C
Hardness
Shore A 90
Material
Sil-Pad K10
Temperatura de lucru
-60 → +180 °C
Tara de origine
United States
Detalii produs
Sil-Pad K10 insulators