Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 19.05 x 12.7mm

Nr. stoc RS: 169-4549Producator: BergquistCod de producator: SPK4-0.006-AC-54
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Specificatii

Dimensiuni

19.05 x 12.7mm

Grosime

0.152mm

Lungime

19.05mm

Latime

12.7mm

Thermal Conductivity

0.9W/m·K

Material

Thin Film Polyimide

Self-Adhesive

Yes

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K4

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Sil-Pad K4 insulators

Informatii indisponibile despre stoc

Incercati din nou mai tarziu

Informatii indisponibile despre stoc

€ 0,96

Buc. (Intr-un pachet de 50) (fara TVA)

€ 1,142

Buc. (Intr-un pachet de 50) (cu TVA)

Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 19.05 x 12.7mm

€ 0,96

Buc. (Intr-un pachet de 50) (fara TVA)

€ 1,142

Buc. (Intr-un pachet de 50) (cu TVA)

Bergquist Self-Adhesive Thermal Interface Pad, 0.152mm Thick, 0.9W/m·K, Thin Film Polyimide, 19.05 x 12.7mm
Informatii indisponibile despre stoc

Documente tehnice

Specificatii

Dimensiuni

19.05 x 12.7mm

Grosime

0.152mm

Lungime

19.05mm

Latime

12.7mm

Thermal Conductivity

0.9W/m·K

Material

Thin Film Polyimide

Self-Adhesive

Yes

Frecventa minima de auto-rezonanta

-60°C

Temperatura maxima de lucru

+180°C

Hardness

Shore A 90

Material

Sil-Pad K4

Temperatura de lucru

-60 → +180 °C

Tara de origine

United States

Detalii produs

Sil-Pad K4 insulators