Documente tehnice
Specificatii
Marca
WinbondMemory Size
512Mbit
Interfata
SPI
Tip pachet
SOIC
Numar pini
16
Organisation
64M x 8
Timp montare
Surface Mount
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensiuni
10.49 x 7.59 x 2.34mm
Number of Words
64M
Temperatura minima de lucru
-40 °C
Number of Bits per Word
8bit
Temperatura maxima de lucru
+85 °C
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P.O.A.
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P.O.A.
44
Documente tehnice
Specificatii
Marca
WinbondMemory Size
512Mbit
Interfata
SPI
Tip pachet
SOIC
Numar pini
16
Organisation
64M x 8
Timp montare
Surface Mount
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensiuni
10.49 x 7.59 x 2.34mm
Number of Words
64M
Temperatura minima de lucru
-40 °C
Number of Bits per Word
8bit
Temperatura maxima de lucru
+85 °C