Documente tehnice
Specificatii
Marca
VishayPeak Average Forward Current
1.2A
Bridge Type
Single Phase
Peak Reverse Repetitive Voltage
800V
Montare
Through Hole
Tip pachet
D 38
Numar pini
4
Diode Technology
Silicon Junction
Configuration
Single
Peak Non-Repetitive Forward Surge Current
52A
Temperatura maxima de lucru
+150 °C
Frecventa minima de auto-rezonanta
-40 °C
Peak Forward Voltage
1.1V
Curentul de varf invers
10µA
Lungime
9.5mm
Dimensiuni
9.5 x 9.5 x 10mm
Inaltime
10mm
Latime
9.5mm
Tara de origine
India
Detalii produs
Bridge Rectifiers with Wire Leads, VS-1KAB-E Series, Vishay Semiconductor
Bridge Rectifiers - Vishay Semiconductor
The Bridge Rectifier converts an Alternating Current (AC) input into a Direct Current (DC) output for full-wave rectification applications. The diode arrangement provides the same polarity of output for either polarity of input. A three-phase full-wave rectifier is an arrangement of six diodes in a bridge circuit configuration. The packages are designed for minimal size, highest reliability and maximum thermal performance.
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Documente tehnice
Specificatii
Marca
VishayPeak Average Forward Current
1.2A
Bridge Type
Single Phase
Peak Reverse Repetitive Voltage
800V
Montare
Through Hole
Tip pachet
D 38
Numar pini
4
Diode Technology
Silicon Junction
Configuration
Single
Peak Non-Repetitive Forward Surge Current
52A
Temperatura maxima de lucru
+150 °C
Frecventa minima de auto-rezonanta
-40 °C
Peak Forward Voltage
1.1V
Curentul de varf invers
10µA
Lungime
9.5mm
Dimensiuni
9.5 x 9.5 x 10mm
Inaltime
10mm
Latime
9.5mm
Tara de origine
India
Detalii produs
Bridge Rectifiers with Wire Leads, VS-1KAB-E Series, Vishay Semiconductor
Bridge Rectifiers - Vishay Semiconductor
The Bridge Rectifier converts an Alternating Current (AC) input into a Direct Current (DC) output for full-wave rectification applications. The diode arrangement provides the same polarity of output for either polarity of input. A three-phase full-wave rectifier is an arrangement of six diodes in a bridge circuit configuration. The packages are designed for minimal size, highest reliability and maximum thermal performance.