Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
STMicroelectronicsTransistor Type
NPN
Maximum Continuous Collector Current
15 A
Maximum Collector Emitter Voltage
350 V
Maximum Emitter Base Voltage
5 V
Tip pachet
TO-3PF
Montare
Through Hole
Numar pini
3
Transistor Configuration
Single
Number of Elements per Chip
1
Minimum DC Current Gain
300
Maximum Base Emitter Saturation Voltage
2.7 V
Maximum Collector Emitter Saturation Voltage
2 V
Temperatura minima de lucru
-65 °C
Inaltime
15.2mm
Dimensiuni
15.7 x 5.7 x 15.2mm
Temperatura maxima de lucru
+175 °C
Lungime
15.7mm
Latime
5.7mm
Detalii produs
NPN Darlington Transistors, STMicroelectronics
Bipolar Transistors, STMicroelectronics
A broad range of NPN and PNP Bipolar Transistors from STMicroelectronics including General Purpose, Darlington, Power and High-Voltage devices in both SMT and Through-hole packages.
€ 4,62
€ 4,62 Buc. (fara TVA)
€ 5,59
€ 5,59 Buc. (cu TVA)
1
€ 4,62
€ 4,62 Buc. (fara TVA)
€ 5,59
€ 5,59 Buc. (cu TVA)
Informatii despre stoc temporar indisponibile
1
Informatii despre stoc temporar indisponibile
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
STMicroelectronicsTransistor Type
NPN
Maximum Continuous Collector Current
15 A
Maximum Collector Emitter Voltage
350 V
Maximum Emitter Base Voltage
5 V
Tip pachet
TO-3PF
Montare
Through Hole
Numar pini
3
Transistor Configuration
Single
Number of Elements per Chip
1
Minimum DC Current Gain
300
Maximum Base Emitter Saturation Voltage
2.7 V
Maximum Collector Emitter Saturation Voltage
2 V
Temperatura minima de lucru
-65 °C
Inaltime
15.2mm
Dimensiuni
15.7 x 5.7 x 15.2mm
Temperatura maxima de lucru
+175 °C
Lungime
15.7mm
Latime
5.7mm
Detalii produs
NPN Darlington Transistors, STMicroelectronics
Bipolar Transistors, STMicroelectronics
A broad range of NPN and PNP Bipolar Transistors from STMicroelectronics including General Purpose, Darlington, Power and High-Voltage devices in both SMT and Through-hole packages.