Documente tehnice
Specificatii
Marca
MolexSerie
MICRO-FIT 3.0
Pitch
3.0mm
Numar contacte
6
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Montare
Surface Mount
Terminal
Solder
Placa contact
Tin
Material de contact
Brass
Dimensiune celula
43045
Curent nominal
5.0A
Tensiune nominala
250.0 V
Detalii produs
Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Molex Micro-Fit 3.0 Series
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€ 1,16
Buc. (Livrat pe rola) (fara TVA)
€ 1,38
Buc. (Livrat pe rola) (cu TVA)
Impachetare pentru productie (Rola)
5
€ 1,16
Buc. (Livrat pe rola) (fara TVA)
€ 1,38
Buc. (Livrat pe rola) (cu TVA)
Impachetare pentru productie (Rola)
5
Documente tehnice
Specificatii
Marca
MolexSerie
MICRO-FIT 3.0
Pitch
3.0mm
Numar contacte
6
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Montare
Surface Mount
Terminal
Solder
Placa contact
Tin
Material de contact
Brass
Dimensiune celula
43045
Curent nominal
5.0A
Tensiune nominala
250.0 V
Detalii produs
Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.