Documente tehnice
Specificatii
Marca
Amphenol ICCNumar contacte
15
Subtip
Female
Body Orientation
Straight
Montare
Through Hole
Pitch
2.29mm
D Connector Type
High Density D-Sub
Terminal
Solder
Curent nominal
2.5A
Housing Material
Thermoplastic
Tensiune nominala
250.0 V
Lungime
30.81mm
Latime
6.1mm
Adancime
12.55mm
Placa contact
Gold over Nickel
Material de contact
Copper Alloy
Serie
10090929
Dimensiuni
30.81 x 6.1 x 12.55mm
Temperatura maxima de lucru
+105°C
Frecventa minima de auto-rezonanta
-55.0°C
Detalii produs
Compact HD with Screw Locks
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.
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Documente tehnice
Specificatii
Marca
Amphenol ICCNumar contacte
15
Subtip
Female
Body Orientation
Straight
Montare
Through Hole
Pitch
2.29mm
D Connector Type
High Density D-Sub
Terminal
Solder
Curent nominal
2.5A
Housing Material
Thermoplastic
Tensiune nominala
250.0 V
Lungime
30.81mm
Latime
6.1mm
Adancime
12.55mm
Placa contact
Gold over Nickel
Material de contact
Copper Alloy
Serie
10090929
Dimensiuni
30.81 x 6.1 x 12.55mm
Temperatura maxima de lucru
+105°C
Frecventa minima de auto-rezonanta
-55.0°C
Detalii produs
Compact HD with Screw Locks
These FCI D-Subminiature High-Density connectors are suitable for applications requiring robust and reliable connectors such as Telecommunications, Data, Consumer, Industrial, Military, Instrumentation and Medical markets. The High-Density range gives Input - Output interconnects to meet all design requirements and addresses the increasing needs for high density packaging.
FCI Compact High Density D-Subminiature Connectors
The FCI High Density D-Subminiature range provides high-density and high-speed interfaces to enable interconnect technologies for storage and memory, networking and complementary products for power distribution. These High Density D-Subminiature connectors enable full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI.