Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
WinslowPitch
0.8 mm, 2.54 mm
End 1
56 Pin Female SOP
End 2
56 Pin Male DIP
End 1 Number of Contacts
56
End 2 Number of Contacts
56
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Montare
Through Hole
Body Orientation
Straight
Material de contact
Brass
Placa contact
Gold over Nickel
Housing Material
FR4
Tara de origine
United Kingdom
Detalii produs
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
€ 41,51
€ 41,51 Buc. (fara TVA)
€ 50,23
€ 50,23 Buc. (cu TVA)
1
€ 41,51
€ 41,51 Buc. (fara TVA)
€ 50,23
€ 50,23 Buc. (cu TVA)
Informatii despre stoc temporar indisponibile
1
Informatii despre stoc temporar indisponibile
| Cantitate | Pret unitar |
|---|---|
| 1 - 24 | € 41,51 |
| 25 - 74 | € 37,00 |
| 75 - 199 | € 32,55 |
| 200 - 399 | € 28,25 |
| 400+ | € 25,94 |
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
WinslowPitch
0.8 mm, 2.54 mm
End 1
56 Pin Female SOP
End 2
56 Pin Male DIP
End 1 Number of Contacts
56
End 2 Number of Contacts
56
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Montare
Through Hole
Body Orientation
Straight
Material de contact
Brass
Placa contact
Gold over Nickel
Housing Material
FR4
Tara de origine
United Kingdom
Detalii produs
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.


