Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
WinbondMemory Size
2Gbit
Interfata
Quad-SPI
Tip pachet
TFBGA
Numar pini
24
Organisation
256M x 8 bit
Timp montare
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensiuni
8.05 x 6.05 x 0.85mm
Number of Bits per Word
8bit
Temperatura maxima de lucru
+85 °C
Number of Words
256M
Temperatura minima de lucru
-40 °C
P.O.A.
Each (In a Tray of 480) (fara TVA)
480
P.O.A.
Each (In a Tray of 480) (fara TVA)
Informatii despre stoc temporar indisponibile
480
Informatii despre stoc temporar indisponibile
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
WinbondMemory Size
2Gbit
Interfata
Quad-SPI
Tip pachet
TFBGA
Numar pini
24
Organisation
256M x 8 bit
Timp montare
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensiuni
8.05 x 6.05 x 0.85mm
Number of Bits per Word
8bit
Temperatura maxima de lucru
+85 °C
Number of Words
256M
Temperatura minima de lucru
-40 °C