Documente tehnice
Specificatii
Marca
VishayPeak Average Forward Current
1A
Bridge Type
Single Phase
Peak Reverse Repetitive Voltage
400V
Timp montare
Surface Mount
Tip pachet
DF-S
Numar pini
4
Configuration
Single
Peak Non-Repetitive Forward Surge Current
50A
Temperatura maxima de lucru
+150 °C
Temperatura minima de lucru
-55 °C
Peak Forward Voltage
1.1V
Curentul de varf invers
5µA
Dimensiuni
8.51 x 6.5 x 3.3mm
Lungime
8.51mm
Inaltime
3.3mm
Latime
6.5mm
Distrelec Product Id
30152183
Detalii produs
Bridge Rectifiers for PCB Surface Mount, DFxxS Series, Vishay Semiconductor
Approvals
UL file E54214
Bridge Rectifiers - Vishay Semiconductor
The Bridge Rectifier converts an Alternating Current (AC) input into a Direct Current (DC) output for full-wave rectification applications. The diode arrangement provides the same polarity of output for either polarity of input. A three-phase full-wave rectifier is an arrangement of six diodes in a bridge circuit configuration. The packages are designed for minimal size, highest reliability and maximum thermal performance.
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Documente tehnice
Specificatii
Marca
VishayPeak Average Forward Current
1A
Bridge Type
Single Phase
Peak Reverse Repetitive Voltage
400V
Timp montare
Surface Mount
Tip pachet
DF-S
Numar pini
4
Configuration
Single
Peak Non-Repetitive Forward Surge Current
50A
Temperatura maxima de lucru
+150 °C
Temperatura minima de lucru
-55 °C
Peak Forward Voltage
1.1V
Curentul de varf invers
5µA
Dimensiuni
8.51 x 6.5 x 3.3mm
Lungime
8.51mm
Inaltime
3.3mm
Latime
6.5mm
Distrelec Product Id
30152183
Detalii produs
Bridge Rectifiers for PCB Surface Mount, DFxxS Series, Vishay Semiconductor
Approvals
UL file E54214
Bridge Rectifiers - Vishay Semiconductor
The Bridge Rectifier converts an Alternating Current (AC) input into a Direct Current (DC) output for full-wave rectification applications. The diode arrangement provides the same polarity of output for either polarity of input. A three-phase full-wave rectifier is an arrangement of six diodes in a bridge circuit configuration. The packages are designed for minimal size, highest reliability and maximum thermal performance.