Documente tehnice
Specificatii
Temperatura minima de lucru
-40 °C
Numar pini
16
Timp montare
Surface Mount
Temperatura maxima de lucru
+125 °C
Maximum Sink Current
800mA
Maximum Source Current
800mA
Minimum Operating Supply Voltage
1.8 V
Maximum Supply Current
3 mA
Inaltime
0.9mm
Latime
4.4mm
Lungime
5mm
Maximum Operating Supply Voltage
75 V
Tip pachet
TSSOP
Marca
Texas InstrumentsDimensiuni
5 x 4.4 x 0.9mm
Detalii produs
RS Pro Low Density ESD Foam
RS Pro low density ESD foam provides pin and component protection to sensitive components. With its ESD properties youre safe to put any component on this foam. Its an effortless foam so you can just push your component onto the foam and know it will stay secure and not tumble around in packaging. This foam is soft and flexible and could ideally be used as soft packaging.
Standards
This conductive foam meets the surface resistance required as per EN 61340-5-1 (tested per IEC 61340-2-3)
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P.O.A.
Standard
1
P.O.A.
Standard
1
Documente tehnice
Specificatii
Temperatura minima de lucru
-40 °C
Numar pini
16
Timp montare
Surface Mount
Temperatura maxima de lucru
+125 °C
Maximum Sink Current
800mA
Maximum Source Current
800mA
Minimum Operating Supply Voltage
1.8 V
Maximum Supply Current
3 mA
Inaltime
0.9mm
Latime
4.4mm
Lungime
5mm
Maximum Operating Supply Voltage
75 V
Tip pachet
TSSOP
Marca
Texas InstrumentsDimensiuni
5 x 4.4 x 0.9mm
Detalii produs
RS Pro Low Density ESD Foam
RS Pro low density ESD foam provides pin and component protection to sensitive components. With its ESD properties youre safe to put any component on this foam. Its an effortless foam so you can just push your component onto the foam and know it will stay secure and not tumble around in packaging. This foam is soft and flexible and could ideally be used as soft packaging.
Standards
This conductive foam meets the surface resistance required as per EN 61340-5-1 (tested per IEC 61340-2-3)