Documente tehnice
Specificatii
Marca
TE ConnectivityPriza
Socket
Subtip
Female
Montare
Through Hole
Terminal
Press-In
Material de contact
Phosphor Bronze
Housing Material
PET
Placa contact
Gold over Palladium Nickel over Nickel
Tara de origine
United States
Detalii produs
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
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Incercati din nou mai tarziu
€ 5,43
Each (In a Tube of 46) (fara TVA)
€ 6,462
Each (In a Tube of 46) (cu TVA)
46
€ 5,43
Each (In a Tube of 46) (fara TVA)
€ 6,462
Each (In a Tube of 46) (cu TVA)
46
Documente tehnice
Specificatii
Marca
TE ConnectivityPriza
Socket
Subtip
Female
Montare
Through Hole
Terminal
Press-In
Material de contact
Phosphor Bronze
Housing Material
PET
Placa contact
Gold over Palladium Nickel over Nickel
Tara de origine
United States
Detalii produs
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.