Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
TE ConnectivityPriza
Socket
Subtip
Female
Montare
Through Hole
Terminal
Press-In
Material de contact
Phosphor Bronze
Housing Material
PET
Placa contact
Gold over Palladium Nickel over Nickel
Tara de origine
United States
Detalii produs
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
€ 250,24
€ 5,44 Each (In a Tube of 46) (fara TVA)
€ 302,79
€ 6,582 Each (In a Tube of 46) (cu TVA)
46
€ 250,24
€ 5,44 Each (In a Tube of 46) (fara TVA)
€ 302,79
€ 6,582 Each (In a Tube of 46) (cu TVA)
Informatii despre stoc temporar indisponibile
46
Informatii despre stoc temporar indisponibile
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
TE ConnectivityPriza
Socket
Subtip
Female
Montare
Through Hole
Terminal
Press-In
Material de contact
Phosphor Bronze
Housing Material
PET
Placa contact
Gold over Palladium Nickel over Nickel
Tara de origine
United States
Detalii produs
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.


