Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
TE ConnectivityNumar contacte
3
Tip produs
Board to Board
Montare
Through Hole
Body Orientation
Straight
Terminal
Solder
Curent nominal
1.15A
Tensiune
250 V
Serie
Z-PACK HM
Material de contact
Copper
Tara de origine
United States
Detalii produs
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
€ 4,84
€ 4,84 Buc. (fara TVA)
€ 5,86
€ 5,86 Buc. (cu TVA)
Standard
1
€ 4,84
€ 4,84 Buc. (fara TVA)
€ 5,86
€ 5,86 Buc. (cu TVA)
Informatii despre stoc temporar indisponibile
Standard
1
Informatii despre stoc temporar indisponibile
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
TE ConnectivityNumar contacte
3
Tip produs
Board to Board
Montare
Through Hole
Body Orientation
Straight
Terminal
Solder
Curent nominal
1.15A
Tensiune
250 V
Serie
Z-PACK HM
Material de contact
Copper
Tara de origine
United States
Detalii produs
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.


