Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
TE ConnectivityNumar contacte
3
Tip produs
Board to Board
Montare
Through Hole
Body Orientation
Straight
Terminal
Solder
Curent nominal
1.15A
Tensiune nominala
250 V
Serie
Z-PACK HM
Material de contact
Copper
Tara de origine
China
Detalii produs
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Informatii despre stoc temporar indisponibile
€ 211,80
€ 3,53 Each (In a Tube of 60) (fara TVA)
€ 256,28
€ 4,271 Each (In a Tube of 60) (cu TVA)
60
€ 211,80
€ 3,53 Each (In a Tube of 60) (fara TVA)
€ 256,28
€ 4,271 Each (In a Tube of 60) (cu TVA)
Informatii despre stoc temporar indisponibile
60
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
TE ConnectivityNumar contacte
3
Tip produs
Board to Board
Montare
Through Hole
Body Orientation
Straight
Terminal
Solder
Curent nominal
1.15A
Tensiune nominala
250 V
Serie
Z-PACK HM
Material de contact
Copper
Tara de origine
China
Detalii produs
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.


