Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
TE ConnectivityNumar contacte
3
Tip produs
Board to Board
Montare
Through Hole
Body Orientation
Straight
Terminal
Solder
Curent nominal
1.15A
Tensiune
250 V
Serie
Z-PACK HM
Material de contact
Copper
Tara de origine
China
Detalii produs
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
€ 244,20
€ 4,07 Each (In a Tube of 60) (fara TVA)
€ 295,48
€ 4,925 Each (In a Tube of 60) (cu TVA)
60
€ 244,20
€ 4,07 Each (In a Tube of 60) (fara TVA)
€ 295,48
€ 4,925 Each (In a Tube of 60) (cu TVA)
Informatii despre stoc temporar indisponibile
60
Informatii despre stoc temporar indisponibile
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
TE ConnectivityNumar contacte
3
Tip produs
Board to Board
Montare
Through Hole
Body Orientation
Straight
Terminal
Solder
Curent nominal
1.15A
Tensiune
250 V
Serie
Z-PACK HM
Material de contact
Copper
Tara de origine
China
Detalii produs
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.


