Documente tehnice
Specificatii
Marca
TE ConnectivityNumar contacte
16
Montare
Through Hole
Tip pin
Standard
Pitch
2.54mm
Row Width
2.54mm
Frame Type
Closed Frame
Terminal
Solder
Placa contact
Gold
Pozitionare
Vertical
Lungime
20.32mm
Latime
10.16mm
Adancime
4.57mm
Dimensiuni
20.32 x 10.16 x 4.57mm
Frecventa minima de auto-rezonanta
-55°C
Temperatura maxima de lucru
+105°C
Housing Material
Thermoplastic
Material de contact
Beryllium Copper
Detalii produs
TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Augat 500 Series
PCB DIP sockets with stamped and formed contacts in a thermoplastic closed frame insulator. These PCB DIP sockets have a 2.54mm centerline with a 7.62 mm row spacing. The contacts of these PCB DIP IC sockets are gold plated with 4 fingered mating.
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Documente tehnice
Specificatii
Marca
TE ConnectivityNumar contacte
16
Montare
Through Hole
Tip pin
Standard
Pitch
2.54mm
Row Width
2.54mm
Frame Type
Closed Frame
Terminal
Solder
Placa contact
Gold
Pozitionare
Vertical
Lungime
20.32mm
Latime
10.16mm
Adancime
4.57mm
Dimensiuni
20.32 x 10.16 x 4.57mm
Frecventa minima de auto-rezonanta
-55°C
Temperatura maxima de lucru
+105°C
Housing Material
Thermoplastic
Material de contact
Beryllium Copper
Detalii produs
TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Augat 500 Series
PCB DIP sockets with stamped and formed contacts in a thermoplastic closed frame insulator. These PCB DIP sockets have a 2.54mm centerline with a 7.62 mm row spacing. The contacts of these PCB DIP IC sockets are gold plated with 4 fingered mating.