Documente tehnice
Specificatii
Marca
TE ConnectivityNumar contacte
6
Montare
Through Hole
Tip pin
Stamped
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Terminal
Solder
Placa contact
Gold over Nickel
Curent nominal
3A
Pozitionare
Vertical
Lungime
50.8mm
Latime
4.57mm
Adancime
17.78mm
Dimensiuni
50.8 x 4.57 x 17.78mm
Frecventa minima de auto-rezonanta
-55°C
Temperatura maxima de lucru
+105°C
Housing Material
PCT
Material de contact
Beryllium Copper
Tara de origine
Switzerland
Detalii produs
TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Augat 500 Series
PCB DIP sockets with stamped and formed contacts in a thermoplastic closed frame insulator. These PCB DIP sockets have a 2.54mm centerline with a 7.62 mm row spacing. The contacts of these PCB DIP IC sockets are gold plated with 4 fingered mating.
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Documente tehnice
Specificatii
Marca
TE ConnectivityNumar contacte
6
Montare
Through Hole
Tip pin
Stamped
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Terminal
Solder
Placa contact
Gold over Nickel
Curent nominal
3A
Pozitionare
Vertical
Lungime
50.8mm
Latime
4.57mm
Adancime
17.78mm
Dimensiuni
50.8 x 4.57 x 17.78mm
Frecventa minima de auto-rezonanta
-55°C
Temperatura maxima de lucru
+105°C
Housing Material
PCT
Material de contact
Beryllium Copper
Tara de origine
Switzerland
Detalii produs
TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Augat 500 Series
PCB DIP sockets with stamped and formed contacts in a thermoplastic closed frame insulator. These PCB DIP sockets have a 2.54mm centerline with a 7.62 mm row spacing. The contacts of these PCB DIP IC sockets are gold plated with 4 fingered mating.