Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
TE ConnectivityNumar contacte
4
Number Of Rows
1
Body Orientation
Right Angle
Pitch
2mm
Material de contact
Copper Alloy
Montare
Through Hole
Curent nominal
16A
Terminal
Press-Fit
Serie
Z-PACK HM
Tara de origine
United States
Detalii produs
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
€ 345,04
€ 9,08 Each (In a Tube of 38) (fara TVA)
€ 417,50
€ 10,987 Each (In a Tube of 38) (cu TVA)
38
€ 345,04
€ 9,08 Each (In a Tube of 38) (fara TVA)
€ 417,50
€ 10,987 Each (In a Tube of 38) (cu TVA)
Informatii despre stoc temporar indisponibile
38
Informatii despre stoc temporar indisponibile
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
TE ConnectivityNumar contacte
4
Number Of Rows
1
Body Orientation
Right Angle
Pitch
2mm
Material de contact
Copper Alloy
Montare
Through Hole
Curent nominal
16A
Terminal
Press-Fit
Serie
Z-PACK HM
Tara de origine
United States
Detalii produs
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.


