Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
TE ConnectivityNumar contacte
4
Number Of Rows
1
Body Orientation
Right Angle
Pitch
2mm
Material de contact
Copper Alloy
Montare
Through Hole
Placa contact
Gold
Curent nominal
16A
Terminal
Press Fit
Serie
Z-PACK
Tara de origine
United States
Detalii produs
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
€ 10,99
€ 10,99 Buc. (fara TVA)
€ 13,30
€ 13,30 Buc. (cu TVA)
Standard
1
€ 10,99
€ 10,99 Buc. (fara TVA)
€ 13,30
€ 13,30 Buc. (cu TVA)
Informatii despre stoc temporar indisponibile
Standard
1
Informatii despre stoc temporar indisponibile
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
TE ConnectivityNumar contacte
4
Number Of Rows
1
Body Orientation
Right Angle
Pitch
2mm
Material de contact
Copper Alloy
Montare
Through Hole
Placa contact
Gold
Curent nominal
16A
Terminal
Press Fit
Serie
Z-PACK
Tara de origine
United States
Detalii produs
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.


