TE Connectivity Vibration Sensor, 0°C → +70°C
Documente tehnice
Specificatii
Marca
TE ConnectivityLungime
41mm
Latime
16mm
Adancime
0.04mm
Frecventa minima de auto-rezonanta
0°C
Temperatura maxima de lucru
+70°C
Dimensiuni
41 (mm) x 16 (mm) x 40 (μm)
Tara de origine
China
Detalii produs
TE Connectivity DT Series Piezoelectric Vibration Sensors
TE Connectivity’s MEAS piezoelectric film sensors are constructed from silver ink screen printed electrodes on rectangular piezo film. Piezo vibration sensors without a lead can be adhered directly to a surface using epoxy resin or double sided tape, and leads can be attached with crimps, eyelets, conductive epoxy or compressive clamping. For the piezoelectric sensors that come with a lead, 28 AWG wire and a riveted lug are used.
Suitable applications include recording the time of an event, sensing dynamic strain, counting the number of impacts, measuring impact related events and making sensor elements.
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Incercati din nou mai tarziu
€ 10,65
Buc. (Intr-o cutie de 100) (fara TVA)
€ 12,674
Buc. (Intr-o cutie de 100) (cu TVA)
100
€ 10,65
Buc. (Intr-o cutie de 100) (fara TVA)
€ 12,674
Buc. (Intr-o cutie de 100) (cu TVA)
100
Documente tehnice
Specificatii
Marca
TE ConnectivityLungime
41mm
Latime
16mm
Adancime
0.04mm
Frecventa minima de auto-rezonanta
0°C
Temperatura maxima de lucru
+70°C
Dimensiuni
41 (mm) x 16 (mm) x 40 (μm)
Tara de origine
China
Detalii produs
TE Connectivity DT Series Piezoelectric Vibration Sensors
TE Connectivity’s MEAS piezoelectric film sensors are constructed from silver ink screen printed electrodes on rectangular piezo film. Piezo vibration sensors without a lead can be adhered directly to a surface using epoxy resin or double sided tape, and leads can be attached with crimps, eyelets, conductive epoxy or compressive clamping. For the piezoelectric sensors that come with a lead, 28 AWG wire and a riveted lug are used.
Suitable applications include recording the time of an event, sensing dynamic strain, counting the number of impacts, measuring impact related events and making sensor elements.