TE Connectivity Vibration Sensor, 0°C → +70°C

Nr. stoc RS: 893-7231Producator: TE ConnectivityCod de producator: 1-1000288-0
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Documente tehnice

Specificatii

Lungime

41mm

Latime

16mm

Adancime

0.075mm

Frecventa minima de auto-rezonanta

0°C

Temperatura maxima de lucru

+70°C

Dimensiuni

41 (mm) x 16 (mm) x 75 (μm)

Detalii produs

TE Connectivity SDT Series Shielded Piezo Vibration Sensors

TE Connectivity’s MEAS SDT series are piezoelectric sensors constructed with a folded film element printed with silver ink attached to moulded plastic housing with an 18” coaxial cable. The folded element self-shields the transducer area, which for high EMI environments is particularly important. Using glue or epoxy, these piezoresistive vibration sensors can be adhered directly to surfaces.

Suitable applications include vibration/impact sensing, acoustic pickup, vibration analysis for equipment and product design, contact microphones, machine monitoring, acoustic emission detection and machine tool chatter detection.

Informatii indisponibile despre stoc

Incercati din nou mai tarziu

Informatii indisponibile despre stoc

P.O.A.

TE Connectivity Vibration Sensor, 0°C → +70°C
Selectati tipul de ambalaj

P.O.A.

TE Connectivity Vibration Sensor, 0°C → +70°C
Informatii indisponibile despre stoc
Selectati tipul de ambalaj

Documente tehnice

Specificatii

Lungime

41mm

Latime

16mm

Adancime

0.075mm

Frecventa minima de auto-rezonanta

0°C

Temperatura maxima de lucru

+70°C

Dimensiuni

41 (mm) x 16 (mm) x 75 (μm)

Detalii produs

TE Connectivity SDT Series Shielded Piezo Vibration Sensors

TE Connectivity’s MEAS SDT series are piezoelectric sensors constructed with a folded film element printed with silver ink attached to moulded plastic housing with an 18” coaxial cable. The folded element self-shields the transducer area, which for high EMI environments is particularly important. Using glue or epoxy, these piezoresistive vibration sensors can be adhered directly to surfaces.

Suitable applications include vibration/impact sensing, acoustic pickup, vibration analysis for equipment and product design, contact microphones, machine monitoring, acoustic emission detection and machine tool chatter detection.