TDK 6.8μF Multilayer Ceramic Capacitor MLCC, 50V dc V, ±20% , SMD

Nr. stoc RS: 916-3087Producator: TDKCod de producator: C4532X7R1H685M250KB
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Documente tehnice

Specificatii

Marca

TDK

Capacitate

6.8µF

Tensiune

50V dc

Package/Case

1812 (4532M)

Timp montare

Surface Mount

Dielectric

X7R

Toleranta

±20%

Dimensiuni

4.5 x 3.2 x 2.5mm

Lungime

4.5mm

Adancime

3.2mm

Inaltime

2.5mm

Serie

C

Temperatura maxima de lucru

+125°C

Temperatura minima de lucru

-55°C

Tip terminal

Surface Mount

Detalii produs

TDK C type 1812 series

MLCC C Series is a monolithic structure that ensures superior mechanical strength and reliability
High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers

Informatii despre stoc temporar indisponibile

€ 5,80

€ 1,16 Buc. (Intr-un pachet de 5) (fara TVA)

€ 6,90

€ 1,38 Buc. (Intr-un pachet de 5) (cu TVA)

TDK 6.8μF Multilayer Ceramic Capacitor MLCC, 50V dc V, ±20% , SMD
Selectati tipul de ambalaj

€ 5,80

€ 1,16 Buc. (Intr-un pachet de 5) (fara TVA)

€ 6,90

€ 1,38 Buc. (Intr-un pachet de 5) (cu TVA)

TDK 6.8μF Multilayer Ceramic Capacitor MLCC, 50V dc V, ±20% , SMD
Informatii despre stoc temporar indisponibile
Selectati tipul de ambalaj

Informatii despre stoc temporar indisponibile

Incercati din nou mai tarziu

CantitatePret unitarPer Pachet
5 - 45€ 1,16€ 5,80
50 - 95€ 0,80€ 4,00
100 - 245€ 0,74€ 3,70
250 - 495€ 0,68€ 3,40
500+€ 0,61€ 3,05

Documente tehnice

Specificatii

Marca

TDK

Capacitate

6.8µF

Tensiune

50V dc

Package/Case

1812 (4532M)

Timp montare

Surface Mount

Dielectric

X7R

Toleranta

±20%

Dimensiuni

4.5 x 3.2 x 2.5mm

Lungime

4.5mm

Adancime

3.2mm

Inaltime

2.5mm

Serie

C

Temperatura maxima de lucru

+125°C

Temperatura minima de lucru

-55°C

Tip terminal

Surface Mount

Detalii produs

TDK C type 1812 series

MLCC C Series is a monolithic structure that ensures superior mechanical strength and reliability
High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers