TDK 330nF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±10% , SMD

Nr. stoc RS: 916-3059PProducator: TDKCod de producator: C3225X7T2E334K200AA
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Documente tehnice

Specificatii

Marca

TDK

Capacitate

330nF

Tensiune

250V dc

Package/Case

1210 (3225M)

Timp montare

Surface Mount

Dielectric

X7T

Toleranta

±10%

Dimensiuni

3.2 x 2.5 x 2mm

Lungime

3.2mm

Adancime

2.5mm

Inaltime

2mm

Dimensiune celula

C

Temperatura maxima de lucru

+125°C

Temperatura minima de lucru

-55°C

Tip terminal

Surface Mount

Detalii produs

TDK Type 1210 Series C3225

MLCC C Series is a monolithic structure that ensures superior mechanical strength and reliability.
High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.

Informatii indisponibile despre stoc

Incercati din nou mai tarziu

Informatii indisponibile despre stoc

€ 0,39

Buc. (Livrat pe rola) (fara TVA)

€ 0,464

Buc. (Livrat pe rola) (cu TVA)

TDK 330nF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±10% , SMD
Selectati tipul de ambalaj

€ 0,39

Buc. (Livrat pe rola) (fara TVA)

€ 0,464

Buc. (Livrat pe rola) (cu TVA)

TDK 330nF Multilayer Ceramic Capacitor MLCC, 250V dc V, ±10% , SMD
Informatii indisponibile despre stoc
Selectati tipul de ambalaj

Cumpara in pachete mari

CantitatePret unitarPer Rola
20 - 80€ 0,39€ 7,80
100 - 180€ 0,24€ 4,80
200 - 480€ 0,22€ 4,40
500 - 980€ 0,20€ 4,00
1000+€ 0,18€ 3,60

Documente tehnice

Specificatii

Marca

TDK

Capacitate

330nF

Tensiune

250V dc

Package/Case

1210 (3225M)

Timp montare

Surface Mount

Dielectric

X7T

Toleranta

±10%

Dimensiuni

3.2 x 2.5 x 2mm

Lungime

3.2mm

Adancime

2.5mm

Inaltime

2mm

Dimensiune celula

C

Temperatura maxima de lucru

+125°C

Temperatura minima de lucru

-55°C

Tip terminal

Surface Mount

Detalii produs

TDK Type 1210 Series C3225

MLCC C Series is a monolithic structure that ensures superior mechanical strength and reliability.
High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.