Documente tehnice
Specificatii
Marca
TDKCapacitate
10µF
Tensiune
35V dc
Package/Case
0805 (2012M)
Timp montare
Surface Mount
Dielectric
X5R
Toleranta
±10%
Dimensiuni
2 x 1.25 x 0.85mm
Lungime
2mm
Adancime
1.25mm
Inaltime
0.85mm
Serie
C
Temperatura maxima de lucru
+85°C
Temperatura minima de lucru
-55°C
Tip terminal
Surface Mount
Detalii produs
TDK C Type 0805 Series, X5R Dielectric
TDK C Series of general purpose multilayer ceramic chip capacitors suited for high frequency and high density type power suppliers.
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
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P.O.A.
Impachetare pentru productie (Rola)
10
Documente tehnice
Specificatii
Marca
TDKCapacitate
10µF
Tensiune
35V dc
Package/Case
0805 (2012M)
Timp montare
Surface Mount
Dielectric
X5R
Toleranta
±10%
Dimensiuni
2 x 1.25 x 0.85mm
Lungime
2mm
Adancime
1.25mm
Inaltime
0.85mm
Serie
C
Temperatura maxima de lucru
+85°C
Temperatura minima de lucru
-55°C
Tip terminal
Surface Mount
Detalii produs
TDK C Type 0805 Series, X5R Dielectric
TDK C Series of general purpose multilayer ceramic chip capacitors suited for high frequency and high density type power suppliers.
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.