Documente tehnice
Specificatii
Marca
SunhayatoBase Material
Synthetic Resin Bonded Paper
Board Type
Plain Copper Board
Number of Sides
1
Dimensiuni
100 x 200 x 1.6mm
Copper Thickness
35µm
FR Material Grade
FR1
Lungime
100mm
Grosime
1.6mm
Latime
200mm
Tara de origine
Japan
Detalii produs
Copper-Clad Laminated Sheet (cut board)
Optocoupler, Intelligent Power Module (IPM) Interface, Avago Technologies
Avago Technologies optocouplers for IPM (Intelligent Power Module) interface exhibit short propagation delay, fast IGBT switching, high common mode transient rejection and wide operating temperature range.
Avago Technologies R2Coupler™ isolation products provide the reinforced insulation and reliability needed for critical automotive and high temperature applications.
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1
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Documente tehnice
Specificatii
Marca
SunhayatoBase Material
Synthetic Resin Bonded Paper
Board Type
Plain Copper Board
Number of Sides
1
Dimensiuni
100 x 200 x 1.6mm
Copper Thickness
35µm
FR Material Grade
FR1
Lungime
100mm
Grosime
1.6mm
Latime
200mm
Tara de origine
Japan
Detalii produs
Copper-Clad Laminated Sheet (cut board)
Optocoupler, Intelligent Power Module (IPM) Interface, Avago Technologies
Avago Technologies optocouplers for IPM (Intelligent Power Module) interface exhibit short propagation delay, fast IGBT switching, high common mode transient rejection and wide operating temperature range.
Avago Technologies R2Coupler™ isolation products provide the reinforced insulation and reliability needed for critical automotive and high temperature applications.