13, Single-Sided Copper Clad Board FR2 With 35μm Copper Thick, 100 x 200 x 1.6mm

Nr. stoc RS: 453-9041Producator: SunhayatoCod de producator: 13
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Specificatii

Base Material

Synthetic Resin Bonded Paper

Board Type

Plain Copper Board

Number of Sides

1

Dimensiuni

100 x 200 x 1.6mm

Copper Thickness

35µm

FR Material Grade

FR1

Lungime

100mm

Grosime

1.6mm

Latime

200mm

Tara de origine

Japan

Detalii produs

Copper-Clad Laminated Sheet (cut board)

Optocoupler, Intelligent Power Module (IPM) Interface, Avago Technologies

Avago Technologies optocouplers for IPM (Intelligent Power Module) interface exhibit short propagation delay, fast IGBT switching, high common mode transient rejection and wide operating temperature range.
Avago Technologies R2Coupler™ isolation products provide the reinforced insulation and reliability needed for critical automotive and high temperature applications.

Informatii indisponibile despre stoc

P.O.A.

13, Single-Sided Copper Clad Board FR2 With 35μm Copper Thick, 100 x 200 x 1.6mm

P.O.A.

13, Single-Sided Copper Clad Board FR2 With 35μm Copper Thick, 100 x 200 x 1.6mm
Informatii indisponibile despre stoc

Informatii indisponibile despre stoc

Incercati din nou mai tarziu

Documente tehnice

Specificatii

Base Material

Synthetic Resin Bonded Paper

Board Type

Plain Copper Board

Number of Sides

1

Dimensiuni

100 x 200 x 1.6mm

Copper Thickness

35µm

FR Material Grade

FR1

Lungime

100mm

Grosime

1.6mm

Latime

200mm

Tara de origine

Japan

Detalii produs

Copper-Clad Laminated Sheet (cut board)

Optocoupler, Intelligent Power Module (IPM) Interface, Avago Technologies

Avago Technologies optocouplers for IPM (Intelligent Power Module) interface exhibit short propagation delay, fast IGBT switching, high common mode transient rejection and wide operating temperature range.
Avago Technologies R2Coupler™ isolation products provide the reinforced insulation and reliability needed for critical automotive and high temperature applications.