Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
STMicroelectronicsTransistor Type
NPN
Maximum DC Collector Current
15 A
Maximum Collector Emitter Voltage
60 V
Tip pachet
TO-247
Timp montare
Through Hole
Maximum Power Dissipation
90 W
Minimum DC Current Gain
20
Transistor Configuration
Single
Maximum Collector Base Voltage
100 V
Maximum Operating Frequency
3 MHz
Numar pini
3
Number of Elements per Chip
1
Dimensiuni
20.15 x 15.75 x 5.15mm
Temperatura maxima de lucru
+150 °C
Detalii produs
NPN Power Transistors, STMicroelectronics
Bipolar Transistors, STMicroelectronics
A broad range of NPN and PNP Bipolar Transistors from STMicroelectronics including General Purpose, Darlington, Power and High-Voltage devices in both SMT and Through-hole packages.
€ 19,50
€ 0,65 Each (In a Tube of 30) (fara TVA)
€ 23,60
€ 0,786 Each (In a Tube of 30) (cu TVA)
30
€ 19,50
€ 0,65 Each (In a Tube of 30) (fara TVA)
€ 23,60
€ 0,786 Each (In a Tube of 30) (cu TVA)
Informatii despre stoc temporar indisponibile
30
Informatii despre stoc temporar indisponibile
| Cantitate | Pret unitar | Per Tub |
|---|---|---|
| 30 - 60 | € 0,65 | € 19,50 |
| 90 - 480 | € 0,45 | € 13,50 |
| 510+ | € 0,39 | € 11,70 |
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
STMicroelectronicsTransistor Type
NPN
Maximum DC Collector Current
15 A
Maximum Collector Emitter Voltage
60 V
Tip pachet
TO-247
Timp montare
Through Hole
Maximum Power Dissipation
90 W
Minimum DC Current Gain
20
Transistor Configuration
Single
Maximum Collector Base Voltage
100 V
Maximum Operating Frequency
3 MHz
Numar pini
3
Number of Elements per Chip
1
Dimensiuni
20.15 x 15.75 x 5.15mm
Temperatura maxima de lucru
+150 °C
Detalii produs
NPN Power Transistors, STMicroelectronics
Bipolar Transistors, STMicroelectronics
A broad range of NPN and PNP Bipolar Transistors from STMicroelectronics including General Purpose, Darlington, Power and High-Voltage devices in both SMT and Through-hole packages.


