Documente tehnice
Specificatii
Marca
SamtecNumar contacte
160
Number Of Rows
8
Pitch
1.27mm
Tip produs
Board to Board
Montare
Surface Mount
Body Orientation
Straight
Terminal
Solder
Curent nominal
2.3A
Tensiune nominala
240 V
Dimensiune celula
SEAF
Material de contact
Copper
Detalii produs
1.27mm SEARAY™ Series Interconnects
SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.
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Documente tehnice
Specificatii
Marca
SamtecNumar contacte
160
Number Of Rows
8
Pitch
1.27mm
Tip produs
Board to Board
Montare
Surface Mount
Body Orientation
Straight
Terminal
Solder
Curent nominal
2.3A
Tensiune nominala
240 V
Dimensiune celula
SEAF
Material de contact
Copper
Detalii produs
1.27mm SEARAY™ Series Interconnects
SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.