Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SamtecSerie
QTE
Product Type
PCB Header
Pitch
0.8mm
Current
1.3A
Numar contacte
40
Housing Material
Liquid Crystal Polymer
Number of Rows
2
Pozitionare
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board-to-Board
Montare
Surface
Material de contact
Phosphor Bronze
Placa contact
Gold
Temperatura minima de lucru
-55°C
Terminal
Solder
Contact Gender
Male
Temperatura maxima de lucru
125°C
Standards/Approvals
No
Tensiune
225 V
Detalii produs
QTE Series High Speed Ground Plane Headers
This range of Board to Board QTE Series 0.8 mm pitch High Speed Ground Plane Headers have Alignment Pins. The Contacts and metal ground planes of these Board-to-Board QTE Series 0.8 mm pitch High Speed Ground Plane Headers have 0.25 μm Gold plating with the tails being Tin plated.
0.8mm Board to Board - Samtec
Informatii despre stoc temporar indisponibile
P.O.A.
Standard
1
P.O.A.
Informatii despre stoc temporar indisponibile
Standard
1
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SamtecSerie
QTE
Product Type
PCB Header
Pitch
0.8mm
Current
1.3A
Numar contacte
40
Housing Material
Liquid Crystal Polymer
Number of Rows
2
Pozitionare
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board-to-Board
Montare
Surface
Material de contact
Phosphor Bronze
Placa contact
Gold
Temperatura minima de lucru
-55°C
Terminal
Solder
Contact Gender
Male
Temperatura maxima de lucru
125°C
Standards/Approvals
No
Tensiune
225 V
Detalii produs
QTE Series High Speed Ground Plane Headers
This range of Board to Board QTE Series 0.8 mm pitch High Speed Ground Plane Headers have Alignment Pins. The Contacts and metal ground planes of these Board-to-Board QTE Series 0.8 mm pitch High Speed Ground Plane Headers have 0.25 μm Gold plating with the tails being Tin plated.


