Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SamtecSerie
Edge Rate ERM8
Pitch
0.8mm
Numar contacte
80
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board to Board
Montare
Surface Mount
Terminal
Solder
Placa contact
Gold
Material de contact
Phosphor Bronze
Curent nominal
1.4A
Tensiune
200.0 V
Detalii produs
ERM8 Series Rugged High Speed Headers Style 5
These Board to Board ERM8 Series, SMT, 0.8 mm pitch high speed Headers from Samtec have 0.76 μm Gold plating on the robust Edge Rate contacts and Tin on the PCB tails. This Board-to-Board range of ERM8 Series, SMT, 0.8 mm pitch high speed Style 5 Headers have an overall board height of 8.91 mm with a wafer height of 4.61 mm.
0.8mm Board to Board - Samtec
Informatii despre stoc temporar indisponibile
P.O.A.
Standard
1
P.O.A.
Informatii despre stoc temporar indisponibile
Standard
1
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SamtecSerie
Edge Rate ERM8
Pitch
0.8mm
Numar contacte
80
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board to Board
Montare
Surface Mount
Terminal
Solder
Placa contact
Gold
Material de contact
Phosphor Bronze
Curent nominal
1.4A
Tensiune
200.0 V
Detalii produs
ERM8 Series Rugged High Speed Headers Style 5
These Board to Board ERM8 Series, SMT, 0.8 mm pitch high speed Headers from Samtec have 0.76 μm Gold plating on the robust Edge Rate contacts and Tin on the PCB tails. This Board-to-Board range of ERM8 Series, SMT, 0.8 mm pitch high speed Style 5 Headers have an overall board height of 8.91 mm with a wafer height of 4.61 mm.


