Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SamtecSerie
ERM8
Product Type
PCB Header
Pitch
0.8mm
Current
1.4A
Housing Material
Liquid Crystal Polymer
Numar contacte
40
Number of Rows
2
Pozitionare
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board-to-Board
Montare
Surface
Material de contact
Phosphor Bronze
Placa contact
Gold
Temperatura minima de lucru
-55°C
Row Pitch
0.8mm
Terminal
Solder
Contact Gender
Male
Temperatura maxima de lucru
125°C
Standards/Approvals
No
Tensiune
200 V
Detalii produs
ERM8 Series Rugged High Speed Headers Style 5
These Board to Board ERM8 Series, SMT, 0.8 mm pitch high speed Headers from Samtec have 0.76 μm Gold plating on the robust Edge Rate contacts and Tin on the PCB tails. This Board-to-Board range of ERM8 Series, SMT, 0.8 mm pitch high speed Style 5 Headers have an overall board height of 8.91 mm with a wafer height of 4.61 mm.
0.8mm Board to Board - Samtec
Informatii despre stoc temporar indisponibile
P.O.A.
Standard
1
P.O.A.
Informatii despre stoc temporar indisponibile
Standard
1
Documente tehnice (Imaginile sunt cu titlu informativ. Va rugam sa consultati specificatiile tehnice.)
Specificatii
Marca
SamtecSerie
ERM8
Product Type
PCB Header
Pitch
0.8mm
Current
1.4A
Housing Material
Liquid Crystal Polymer
Numar contacte
40
Number of Rows
2
Pozitionare
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board-to-Board
Montare
Surface
Material de contact
Phosphor Bronze
Placa contact
Gold
Temperatura minima de lucru
-55°C
Row Pitch
0.8mm
Terminal
Solder
Contact Gender
Male
Temperatura maxima de lucru
125°C
Standards/Approvals
No
Tensiune
200 V
Detalii produs
ERM8 Series Rugged High Speed Headers Style 5
These Board to Board ERM8 Series, SMT, 0.8 mm pitch high speed Headers from Samtec have 0.76 μm Gold plating on the robust Edge Rate contacts and Tin on the PCB tails. This Board-to-Board range of ERM8 Series, SMT, 0.8 mm pitch high speed Style 5 Headers have an overall board height of 8.91 mm with a wafer height of 4.61 mm.


